© Reuters. FILE PHOTO: Nishimura Yasutoshi, Minister of Economy, Trade and Industry (METI), talks during an interview with Reuters in Tokyo, Japan, April 5, 2023. REUTERS/Androniki Christodoulou/File Photo
TOKYO (Reuters) – Japan and the United States are expected to issue a joint statement on semiconductor and cutting-edge technology cooperation on Friday, the Yomiuri daily newspaper reported.
The two countries are set to issue the statement upon the meeting between Japanese industry minister Yasutoshi Nishimura and U.S. commerce secretary Gina Raimondo in Detroit, the Yomiuri reported.
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